Technologies

TEC High Efficiency Thermo Electeric Cooler

Thermoelectric systems are solid-state devices that directly convert electrical energy into temperature differential without the use of gases, compressors or any other moving parts.
A standard thermoelectric system consists of:

  • Cold side and hot side heat sink assemblies with or without fans
  • Thermoelectric (Peltier) cooling modules
  • Temperature controller
  • Power supply

The only moving parts are fans, which make thermoelectric systems more compact, reliable and quiet relative to conventional compressor based cooling systems.
A basic element of the thermoelectric system is the Thermoelectric Module (TEM), which actually operates as a heat pump.

The TEM is a solid-state semiconductor device made of two thin ceramic plates with a large quantity of semiconductor elements sandwiched between the plates.

Two types of semiconductors, P and N types, are used in the module. They are connected electrically in series and thermally in parallel in such a way that all cold junctions are placed on one plate and all hot junctions on the opposite plate. Electrical current passing through the junctions absorbs heat energy on the cold junctions, which is then dissipated on the hot junctions.

To ensure the TEM’s cooling performance, the heat energy should be efficiently dissipated from the hot plate to the surrounding atmosphere.

Heat Pipe & Vapor Chamber Technology

The Need


Trends towards higher speed, higher power consumption and denser packaging of electronic components, have generated a need for effective Thermal Management solutions. The reliable performance of the component and long life are directly related to effectively controlling its junction temperature within specific limits.

In special applications, due to enclosure miniaturization, there is a need for an effective cooling solution that removes high heat flux by a very small heat exchange element. Due to the height limitation, even the most efficient air cooled heat sinks, not to mention liquid coolers, are insufficient. The only way to solve such a problem is to transport the heat from the component to an outer area, where cooling fins can be located. In some cases, in order to dissipate the heat produced by a component, it is necessary to spread it uniformly throughout the heat sink’s base plate.

The Solution – Heat Pipes or Vapor Chambers


The best solution for isothermal heat transfer is to utilize a Heat Pipe or a vapor chamber. Heat Pipes & vapor chambers have an inherent thermal conductivity which, if properly designed, can reach more than 1000 times that of copper the same size. A Heat Pipe or vapor chamber consists of a vacuumed sealed metal container (usually copper or aluminum), whose inner surfaces are made of a capillary wicking material. Inside the container is a small quantity of liquid, usually water, under its own pressure, that enters the pores of the capillary material, wetting internal surfaces. Applying heat at any point along the surface causes the liquid to boil and enter a vapor state. When that happens, the liquid picks up the latent heat of vaporization. The gas, having a higher pressure, moves inside the sealed container to a colder location where it condenses. Thus, the gas gives up the latent heat of vaporization and moves heat from the input to the output end of the Heat Pipe or the vapor chamber. Due to high efficient heat transfer by phase transformation, heat fluxes inside a Heat Pipe & vapor chambers are considerable and temperature gradients are very small.

In themselves, Heat Pipes or vapor chambers do not function as heat sinks or cold plates. They can be part of a complete cooling solution, designed to move the heat efficiently from the heat-generating device to another location where an air or liquid stream can take the heat away. Heat Pipes & vapor chambers can be designed and manufactured in various shapes and sizes to fit the customer’s specific needs and requirements.


Heat Pipes & vapor chambers Advantages


Ability to relocate the heat sink away from the device that needs to be cooled.
Reduced volume and weight.
Reliability – Long product life (more than 10 years), no moving parts.
Ability to operate in any environmental conditions, including the absence of gravitation.
Uses no outside power for heat transfer


Double Check’s Capabilities


Double Check’s expert engineers provide you with a complete Heat Pipe or vapor chamber based cooling system, designed to fit your exact requirements. A typical design process includes the following stages: Analysis of the actual thermal problem – in order to define the required solution. The data gathered in this phase enables our engineers to estimate the parameters of the suitable Heat Pipe or the vapor chamber (such as working liquid, case material, tube diameter, porous capillary structure and case wall thickness). In order to define the cooling fins’ structure, we need the following data: number, dimensions and power dissipation of each component to be cooled, maximum allowable component’s case temperature, maximum ambient air temperature, and air convection conditions. Based on this information, Double Check can obtain the characteristics of the suitable fins’ parameters.

Complete Custom-Made Solutions

Continuous innovations in the Power Electronic Packaging industry demand equally continuous improvements in Thermal Management. The design time cycles are decreasing in view of the competitive marketplace. Moreover, modern thermal demands may require the combination of one or more cooling technologies. Double Check has it all! Its strong multi-disciplinary engineering skills enable Double Check to offer complete, reliable, cost-effective and highly efficient solutions for various applications. Double Check specializes in design and production of a range of Thermal Management products, among which are: Heat Sinks, Cold Plates, Thermoelectric Systems Heat Pipes and vapor chambers. Double Check is prepared to apply any Thermal Management discipline to meet your requirements.

Liqid Cooling Plates

TEG Thermo Electric Generator

Thermoelectric cooling

Thermoelectric Cooling Heating Plate for Thermal Testing

Specification Rev 02

  1. General description
    Thermoelectric Cooling/Heating Plate is designed for thermal testing of the electronic components and assembles at wide temperature range from -45 C to 115 C and consists of the following main components:
  • Bench top unit with cold/hot plate and control panel with temperature display allowing set of controlled temperature
  • Liquid chiller with power supply/control box
  • Flexible hose connecting between chiller and bench top unit

  1. Mechanical performance
  • Overall dimensions of the bench top unit: 360 x 375 x 80 mm
  • Overall dimensions of the chiller: 325 (W) x 550 (D) x 700 (H) mm (including power supply/control box)
  • Hose dimensions: diameter- 60 mm, length – 2 m (optionally 3m)
  • Cold/hot plate dimensions: 200 x 250 mm
  1. Electrical performance
  • Input voltage: 230 VAC, 50 Hz
  • Input current: 7A
  1. Thermal performance
  • Cold/hot plate temperature range: -45 C … 115 C
  • Maximum heat dissipation of the component
    to be tested: 40 Watts
  • Cooling time from 25 C to -45 C : 20 min
    (at chiller’s liquid temperature range: -10 C … -15 C without components power dissipations)
  • Heating time from 25 C to 115 C: 20 min
    (at chiller’s liquid temperature range: -10 C … -15 C without components power dissipations)
  1. Communication
  • Communication with PC: RS485
  • Connector type: USB
  • Length of the communication cable: 2 m

 

Heat Sink

We at Double Check specialize in the development and design of thermal management systems, serving many customers worldwide from various industries.

Our experienced, innovative and interdisciplinary team own strong, thermal, thermoelectric, manufacturing skills dedicated to providing you with the services that suite your application and requirements.

Our services include the use of:

  • State-of-the-Art Thermal Analysis
  • Heat Pipes and Vapor Chamber Design
  • Phase Change Materials (PCM) and PCM based Heat Exchangers
  • Thermoelectric System Design and Development
  • Heat Sink Design and Development
  • Testing and Evaluation of Thermal Management Systems
  • Arrangement of Research Projects for Cooling of Electronics
  • Telecommunications indoor/outdoor applications.
  • Large to Small Enclosure Cooling Using: Air Conditioning, Heat Exchangers, Phase Change Materials
  • and/or fully passive systems Liaison with CFD and Heat Sink Manufacturers

Contact us